Home > Newly Shipped PCB > Taconic RF-60A 2-Layer 50mil Organic-Ceramic PCB with Pure Gold Plating

Taconic RF-60A 2-Layer PCB
PCB Material:Taconic RF-60A / 50mil (1.27mm)
MOQ:1PCS
Price:2.99-129 USD/PCS
Packaging:Vacuum / Anti-static Packaging
Delivery Period:6-10 working days
Payment Method:T/T, Paypal
 

Taconic RF-60A 2-Layer 50mil Organic-Ceramic PCB with Pure Gold Plating


1.Introduction of Core

RF-60A is an organic-ceramic laminates in the ORCER family of Taconic products. It is based on woven glass reinforcement. RF-60A is a result of Taconic's expertise in both ceramic fill technology and in coated PTFE fiberglass.


RF-60A exhibits exceptional interlaminar bond strength and solder resistance. RF-60A's proprietary composition results in low moisture absorption and uniform electrical properties. RF-60A's woven glass reinforcement ensures excellent dimensional stability and enhances flexural strength. The RF-60A laminate exhibits low Z-axis expansion allowing for plated-through-hole reliability in extreme thermal environments.


2.Key Features

Dielectric Constant (Dk) of 6.15 at 10 GHz
Dissipation factor of 0.0038 at 10 GHz/23°C
Low moisture absorption of 0.02%
Thermal conductivity of 0.4W/MK
CTE X-axis of 9 ppm/°C, Y-axis of 8 ppm/°C and 69 ppm/°C on Z-axis
Outgassing of 0.02% TML, 0.01% WVR


3.Benefits

RoHS and WEEE compliant
Exceptional interlaminar bond strength
Low moisture absorption for consistent electrical performance
Enhanced dimensional stability for reliable fabrication
Low Z-axis expansion for plated-through-hole reliability in extreme thermal environments
Stable Dk over frequency
Increased flexural strength due to woven glass reinforcement
Uniform electrical properties


Taconic RF-60A PCB


4.PCB Construction Details

Specification Value
Base MaterialRF-60A
Layer Count2 layers
Board Dimensions87mm × 29mm (±0.15mm)
Minimum Trace/Space5/6 mils
Minimum Hole Size0.4mm
Blind ViasNo
Finished Board Thickness1.5mm
Finished Cu Weight (Outer Layers)1 oz (1.4 mils)
Via Plating Thickness20 μm
Surface FinishPure Gold Plating (100 μinch)
Top SilkscreenNo
Bottom SilkscreenNo
Top Solder MaskNo
Bottom Solder MaskNo
Electrical Test100% prior to shipment

5.PCB Stackup (2-Layer Rigid Structure)

Copper layer 1 – 35 μm
RF-60A – 1.27 mm (50mil)
Copper layer 2 – 35 μm


6.PCB Statistics:

Components: 24
Total Pads: 39
Thru Hole Pads: 17
Top SMT Pads: 22
Bottom SMT Pads: 0
Vias: 48
Nets: 2


7.Typical Applications

Power Amplifiers
Filters, Couplers
Miniaturized Antennas
Passive components


8.Quality Assurance

Artwork supplied: Gerber RS-274-X
Accepted standard: IPC-Class-2
Availability: Worldwide


 

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